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Title:
【発明の名称】IC素子加工方法
Document Type and Number:
Japanese Patent JP2962474
Kind Code:
B2
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Inventors:
YAMAGUCHI HIROSHI
PPONGO MIKIO
MYAUCHI TAKEOKI
SHIMASE AKIRA
HARAICHI SATOSHI
TAKAHASHI TAKAHIKO
SAITO HIROYA
Application Number:
JP12310798A
Publication Date:
October 12, 1999
Filing Date:
May 06, 1998
Export Citation:
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Assignee:
HITACHI SEISAKUSHO KK
International Classes:
H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205
Domestic Patent References:
JP59168652A
JP60245227A
Other References:
【文献】米国特許4259367(US,A)
Attorney, Agent or Firm:
Sakuta Yasuo



 
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