Title:
【考案の名称】電子部品用パッケージ
Document Type and Number:
Japanese Patent JP3015080
Kind Code:
U
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Inventors:
Ryuji Komatsu
Application Number:
JP1665894U
Publication Date:
August 29, 1995
Filing Date:
December 07, 1994
Export Citation:
Assignee:
Nippon Micron Co., Ltd.
International Classes:
(IPC1-7): H01L23/12