Title:
【発明の名称】ポリイミド樹脂及びその製造方法
Document Type and Number:
Japanese Patent JP3030079
Kind Code:
B2
Abstract:
A polyimide resin composition with outstanding heat resistance and mechanical properties is disclosed, along with a novel method of its preparation. A tetracarboxylic acid or its derivative and an aromatic diamine are dissolved in a solvent system of mixed phenols and are both polymerized and imidized on one step.
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Inventors:
Hiroshi Itaya
Application Number:
JP31525490A
Publication Date:
April 10, 2000
Filing Date:
November 20, 1990
Export Citation:
Assignee:
W. Earl Grace and Company-Corn
International Classes:
C08L79/08; C08G73/10; C08K5/13; (IPC1-7): C08L79/08; C08G73/10; C08K5/13
Domestic Patent References:
| JP3199233A | ||||
| JP4331230A | ||||
| JP4726878B1 |
Attorney, Agent or Firm:
Jun Tsuda (3 others)