【発明の名称】射出成形印刷回路板の製造方法

Title:

【発明の名称】射出成形印刷回路板の製造方法

Document Type and Number:

Japanese Patent JP3061670

Kind Code:

B2

Abstract:

Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

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Inventors:

Gerhard Dieter Wolff
Henning Gizetzke
Joachim Bank

Application Number:

JP32394691A

Publication Date:

July 10, 2000

Filing Date:

November 13, 1991

Export Citation:

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Assignee:

Bayer Actien Gezershyaft

International Classes:

B29C45/14; B29C45/16; H05K3/00; H05K3/18; H05K3/20; B29K105/20; B29L31/34; H05K1/00; H05K3/10; (IPC1-7): H05K3/00; B29C45/14; B29C45/16

Domestic Patent References:

JP6450497A
JP194691A
JP2268492A

Attorney, Agent or Firm:

Heikichi Odashima

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