Title:
【発明の名称】半導体冷却装置
Document Type and Number:
Japanese Patent JP3067399
Kind Code:
B2
Abstract:
A cooling apparatus (10) for electronic device comprises an electronic element unit (11) which comprises a base member (14), a thermal conductive electric insulating layer (15) soldered to the base member (14) and a plurality of electronic elements (16) soldered to the thermal conductive electric insulating layer (15); at least one cooling unit (12) which is detachably kept in pressure contact with the base member (14) of the electronic element unit (11) and comprises a cooling block (19), at least one heat pipe (21) having a refrigerant (22) sealingly contained therein and inserted in the cooling block (19) at one end thereof and a plurality of radiation fins (23) provided at the other end of the at least one heat pipe (21); and a device (13) which serves to detachably keep the electronic element unit (11) and the cooling unit (12) in pressure contact with each other. The other end of the heat pipe (21) extends obliquely with a predetermined angle ( alpha ) with respect to the inserted portion thereof.
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Inventors:
Heikichi Kuwahara
Kazumasa Fujioka
Toshio Takasaki
Hideharu Saito
Eiichi Toyoda
Kazumasa Fujioka
Toshio Takasaki
Hideharu Saito
Eiichi Toyoda
Application Number:
JP17649792A
Publication Date:
July 17, 2000
Filing Date:
July 03, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/427; H01L25/07; H02M7/04; B60L15/00; H02M7/48; H05K7/20; (IPC1-7): H01L23/427; H05K7/20
Domestic Patent References:
| JP61108155A | ||||
| JP6134744U | ||||
| JP55176569U |
Attorney, Agent or Firm:
Yasuo Sakuta