Title:
映像集積回路組合せ構造
Document Type and Number:
Japanese Patent JP3129846
Kind Code:
U
Abstract:
An image integrated circuit includes a light sensor layer and a semiconductor circuit layer. The light sensor layer receives and converts the light of a photographed image and into a corresponding light-induced electrical signal. The bottom of the light sensor layer form conductive terminals for supplying the light-induced electrical signal to the semiconductor circuit layer formed on the bottom of the light sensor layer. The semiconductor circuit layer receives and processes the light-induced electrical signal and in turn generates digital image signal/data so as to realize reconstruction of the image realistically, reducing the cost to produce and layout semiconductor circuits, and reducing the size of the image integrated circuit.
Inventors:
Baimatsu
Application Number:
JP2006010152U
Publication Date:
March 08, 2007
Filing Date:
December 14, 2006
Export Citation:
Assignee:
Baimatsu
International Classes:
H01L27/14
Attorney, Agent or Firm:
Matsuji Takemoto
Hideo Sugiyama
Koichi Yuda
Uozumi Takahiro
Naohiko Teshima
Hideo Sugiyama
Koichi Yuda
Uozumi Takahiro
Naohiko Teshima