PURPOSE: To contrive the improvement of the precision of an inspection without making an artificial mistake interpose by a method wherein an IC inspecting jig is provided with connecting pins, which are moved by leads to protrude from the outer frame body of an IC, and a substrate adhered with a conductive material which is short-circuited or opened by these pins.

CONSTITUTION: An IC 3 is stepped in the direction shown by an arrow, the IC 3 is loaded on the surface, which is an insulating material, of a substrate 1 while leads of the IC 3 are inserted in insertion holes of the substrate 1, the IC 3 is pressed to the direction shown by the arrow and the points of the leads are brought into contact to connecting pins 2 at a contact pressure to correspond to the amount of a margin to shrink plungers 2b and springs 2c of the pins 2. Here, if the leads of the IC 3 all exist, the plungers 2b of all the pins 2 are isolated from the conductive material of the substrate 1 and a continuity results in not existing between first and second wirings 4 and 5. In case a lead does not exist, the plunger 2b, which exist at a place where the lead does not exist, of a pogo pin 2 is remained as it is made to ascend and a continuity exists between the wirings 4 and 5. Thereby, an artificial mistake is eliminated and the precision of an inspection can be improved.