【発明の名称】半導体回路装置用配線および半導体回路装置

Title:

【発明の名称】半導体回路装置用配線および半導体回路装置

Document Type and Number:

Japanese Patent JP3131239

Kind Code:

B2

Abstract:

A semiconductor circuit device wiring is provided in which the wiring connected to a semiconductor element is composed of a crystalline material. The crystal axis direction along which nearest neighboring atoms in a single crystal constituting the crystalline material are arranged and the electric current direction through the wiring are crossed with each other at an angle of 22.5 DEG or less.

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Inventors:

Kazuo Tsubouchi
Kazuya Masu
Youhei Hiura
Tadahiro Ohmi

Application Number:

JP9555891A

Publication Date:

January 31, 2001

Filing Date:

April 25, 1991

Export Citation:

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Assignee:

Canon Inc

International Classes:

H01L21/3205; H01L23/52; H01L23/532; (IPC1-7): H01L21/3205

Attorney, Agent or Firm:

Yoshikazu Tani (1 person outside)

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