Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3287838
Kind Code:
B2
Inventors:
Hirofumi Sumi
Application Number:
JP15188490A
Publication Date:
June 04, 2002
Filing Date:
June 11, 1990
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/3205; H01L21/28; H01L21/336; H01L21/768; H01L23/52; H01L29/78; (IPC1-7): H01L21/28; H01L21/3205; H01L21/336; H01L21/768; H01L29/78
Attorney, Agent or Firm:
Masaru Tsuchiya
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