Title:
【発明の名称】比較検査方法とその装置
Document Type and Number:
Japanese Patent JP3316829
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To detect minute foreign matters of a size of about 0.2 to 0.5 μm or a minute pattern defect without being affected by the array error between chips while pixels are kept large. SOLUTION: This device defects the position of a reference mark formed in accordance with each of at least two chips among a large number of chips formed on a substrate (wafer) 1 and then calculates the array errors of the chips. When a difference image is obtained by comparing the detection image of one chip with the detection image of the other chip while a detection element 5 detects the image of the one chip and a memory 201 delays and stores the image, respectively, the image of the other chip is detected by the element 5 in a state in which, e.g. a parallel plate 19 corrects the array error.
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Inventors:
Nobuyuki Akiyama
Toshihiko Nakata
Toshihiko Nakata
Application Number:
JP2000180723A
Publication Date:
August 19, 2002
Filing Date:
June 12, 2000
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G06T1/00; H01L21/66; G01N21/956; (IPC1-7): G06T1/00; G01N21/956; H01L21/66
Domestic Patent References:
JP6243505A | ||||
JP6275302A | ||||
JP57208441A | ||||
JP1248616A |
Attorney, Agent or Firm:
Masami Akimoto