Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3331757
Kind Code:
B2
Inventors:
Atsushi Sekiguchi
Application Number:
JP17089094A
Publication Date:
October 07, 2002
Filing Date:
July 22, 1994
Export Citation:
Assignee:
ソニー株式会社
International Classes:
G03F7/11; C23F1/00; G03F7/20; H01L21/027; (IPC1-7): H01L21/027; G03F7/11
Domestic Patent References:
| JP61276221A | ||||
| JP60217631A | ||||
| JP4132211A | ||||
| JP684789A | ||||
| JP714762A |
Attorney, Agent or Firm:
Toru Takatsuki