Title:
【発明の名称】車両用半導体回路冷却装置
Document Type and Number:
Japanese Patent JP3369984
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve cooling performance and make the device smaller and lighter. SOLUTION: On the side of a sealed space provided by parting boards 4 in a case 1, a cooling block 10 having a circuit attaching surface 10a that is long in the longitudinal direction and is formed along the horizontal and vertical directions is disposed. A first and fourth switching circuits Q1, Q4 and clamping diode circuits D1, D2 are attached onto this circuit attaching surface 10a. A cooling pipe 12 disposed in the open space 3 has a straight shape without bending, and one end side thereof is embedded in the cooling block 10.
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Inventors:
Kazuaki Fukuda
Takashi Hashimoto
Takashi Hashimoto
Application Number:
JP31771398A
Publication Date:
January 20, 2003
Filing Date:
November 09, 1998
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/427; (IPC1-7): H01L23/427
Domestic Patent References:
| JP7231057A | ||||
| JP5183077A | ||||
| JP6163769A |
Attorney, Agent or Firm:
Kazuo Sato (3 others)