Title:
【発明の名称】キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板
Document Type and Number:
Japanese Patent JP3370624
Kind Code:
B2
Abstract:
To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic adhesive interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the adhesive interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic adhesive interface layer and the electrodeposited copper layer are formed.
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Inventors:
Atsushi Yoshioka
Akiko Sugimoto
Sakiko Taenaka
Makoto Dobashi
Tsutomu Higuchi
Takuya Yamamoto
Kenichiro Iwakiri
Akiko Sugimoto
Sakiko Taenaka
Makoto Dobashi
Tsutomu Higuchi
Takuya Yamamoto
Kenichiro Iwakiri
Application Number:
JP23756599A
Publication Date:
January 27, 2003
Filing Date:
August 24, 1999
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
H05K3/00; B32B15/08; C25D1/04; C25D1/22; C25D3/38; C25D5/54; C25D7/06; H05K1/09; H05K3/02; (IPC1-7): B32B15/08; C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
| JP63274795A | ||||
| JP2113591A | ||||
| JP5102630A | ||||
| JP10226009A | ||||
| JP10146915A |
Attorney, Agent or Firm:
Daisuke Tanaka