Title:
プリント配線板の絶縁信頼性試験方法
Document Type and Number:
Japanese Patent JP3997762
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of examining the insulation reliability of printed wiring board capable of easily evaluating in a short time without breaking any insulation materials a decrease in the insulation reliability caused by ion migration in a printed wiring board which has been mounted with high density. SOLUTION: The method of examining the insulation reliability of printed wiring board has a comparison step of comparing insulation resistance values. The resistance values include a value that is measured at a high temperature in a case where a through hole of the printed wiring board is a positive electrode and an inner-layer circuit copper foil is a negative electrode, and a value that is measured at a high temperature in a case where the through hole is a negative electrode and the inner-layer circuit copper foil is a positive electrode.
Inventors:
Mitsuru Yamanaka
Yokosuka Yoko
Yokosuka Yoko
Application Number:
JP2001354823A
Publication Date:
October 24, 2007
Filing Date:
November 20, 2001
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G01R31/02; H05K3/00
Domestic Patent References:
| JP9178796A |
Attorney, Agent or Firm:
Tetsuo Hotaka