電子部品実装用フィルムキャリアテープの液処理装置

Title:

電子部品実装用フィルムキャリアテープの液処理装置

Document Type and Number:

Japanese Patent JP4027019

Kind Code:

B2

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Inventors:

Sadahiko Koura
Tetsuyuki Narabayashi
Toshio Katsute
Ryoji Kato

Application Number:

JP2000222661A

Publication Date:

December 26, 2007

Filing Date:

July 24, 2000

Export Citation:

Assignee:

Mitsui Mining & Smelting Co., Ltd.

International Classes:

H01L21/60; B05C5/00

Domestic Patent References:

Attorney, Agent or Firm:

Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki

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