Title:
垂直方向に集積された半導体素子及びその製法
Document Type and Number:
Japanese Patent JP4033903
Kind Code:
B2
Abstract:
PCT No. PCT/DE96/02108 Sec. 371 Date May 19, 1998 Sec. 102(e) Date May 19, 1998 PCT Filed Nov. 6, 1996 PCT Pub. No. WO97/19462 PCT Pub. Date May 29, 1997A vertically integrated semiconductor component is provided with component levels disposed on different substrates. The substrates are joined by a connecting layer of benzocyclobutene and an electrical connection is provided between component levels by a vertical contact structure. A low-stress gluing is provided by the benzocyclobutene connecting layer.
Inventors:
Christul Lauterbach
Werner Weber
Werner Weber
Application Number:
JP51927597A
Publication Date:
January 16, 2008
Filing Date:
November 06, 1996
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L27/00; H01L21/58; H01L21/768; H01L21/98; H01L23/48; H01L23/522; H01L23/532; H01L25/065
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel