Title:
半導体ウェーハを流体中で処理する方法
Document Type and Number:
Japanese Patent JP4054374
Kind Code:
B2
Abstract:
Provided is a process for removing organic materials from semiconductor wafers. The process involves the use of subambient deionized water with ozone absorbed into the water. The ozonated water flows over the wafers and the ozone oxidizes the organic materials from the wafers to insoluble gases. The ozonated water may be prepared in-situ by diffusing ozone into a tank containing wafers and subambient deionized water. Also provided is a tank for the treatment of semiconductor wafers with a fluid and a gas diffuser for diffusion of gases directly into fluids in a wafer treatment tank.
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Inventors:
Matthews Robert Roger
Application Number:
JP50471195A
Publication Date:
February 27, 2008
Filing Date:
July 15, 1994
Export Citation:
Assignee:
Legacy Systems Incorporated
International Classes:
B08B3/10; H01L21/304; B08B3/04; B08B3/08; B08B3/12; B65D85/84; C02F1/32; C02F1/72; C02F1/78; C23G5/00; H01L21/00; H01L21/306
Domestic Patent References:
| JP3136329A | ||||
| JP1132126A |
Attorney, Agent or Firm:
Kosaku Sugimura
Kenji Sugimura
Kazuyuki Tomita
Kenji Sugimura
Kazuyuki Tomita