Title:
半導体装置梱包方法
Document Type and Number:
Japanese Patent JP4064203
Kind Code:
B2
Abstract:
A method of making a moisture-proof package that holds semiconductor devices and desiccant is provided. A tray that retains desiccant is prepared. Semiconductor devices are placed on the tray, and the semiconductor devices and the desiccant carried by the tray are then heat treated before being sealed in a moisture-proof bag. Once the semiconductor devices are shipped to customers, the tray and desiccant are both reused until the moisture absorbing properties of the desiccant diminish.
Inventors:
Yukio Shibata
Application Number:
JP2002304458A
Publication Date:
March 19, 2008
Filing Date:
October 18, 2002
Export Citation:
Assignee:
Kawasaki Microelectronics, Inc.
International Classes:
B65D81/26; B65D85/86; H01L21/673
Domestic Patent References:
| JP1294476A | ||||
| JP2001055274A | ||||
| JP10194348A | ||||
| JP2000043979A |
Attorney, Agent or Firm:
Yoshio Kosugi
Masaki Yamada
Masaki Yamada