Title:
バンプ形状計測装置及びその方法
Document Type and Number:
Japanese Patent JP4147169
Kind Code:
B2
Abstract:
The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.
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Inventors:
Hideaki Sasazawa
Nomoto Mineo
Masatoshi Yamaya
Iwata Riki
Uehara Masashi
Nomoto Mineo
Masatoshi Yamaya
Iwata Riki
Uehara Masashi
Application Number:
JP2003357510A
Publication Date:
September 10, 2008
Filing Date:
October 17, 2003
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
G01B11/24; G01B11/06; G06K9/00; G06T7/00; H05K3/34; H05K3/46; H05K3/40
Domestic Patent References:
| JP2002013917A | ||||
| JP9096611A | ||||
| JP2003130620A | ||||
| JP2000337823A | ||||
| JP56070407A | ||||
| JP200561953A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
Katsuo Ogawa
Kyosuke Tanaka
Katsuo Ogawa
Kyosuke Tanaka