Title:
ボールグリッドアレイデバイスの取付装置
Document Type and Number:
Japanese Patent JP4170259
Kind Code:
B2
Abstract:
Ball grid array devices are mounted in a burn-in and test socket which has a top surface sockets which have top surfaces with windows for the ball terminals terminal balls depending from the ball grad grid array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals terminal balls. The ends of the contact members are urged into contact with the ball terminals terminal balls between the center of the ball terminal ball and the surface of the ball grid array device, thus retaining the device in the socket.
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| JP2000068339 | IC SOCKET FOR BURN-IN BOARD |
Inventors:
WAYNE K.PFAFF
Application Number:
JP2004164921A
Publication Date:
October 22, 2008
Filing Date:
June 02, 2004
Export Citation:
Assignee:
WAYNE K.PFAFF
International Classes:
G01R31/26; G01R1/04; G01R1/073; H01L21/66; H01L23/32; H01R12/88; H01R13/193; H01R33/76; H05K7/10
Domestic Patent References:
| JP2309579A | ||||
| JP4135189U | ||||
| JP367186A | ||||
| JP63222274A |
Foreign References:
| WO1993020675A1 |
Attorney, Agent or Firm:
Shunsuke Nakao
Takashi Ito
Takashi Ito