Title:
抵抗溶接方法、装置、および電子部品の製造方法
Document Type and Number:
Japanese Patent JP4187066
Kind Code:
B2
Abstract:
In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing line, a plurality of second welding electrodes in contact with the metal member is provided so as to provide a plurality of current flow paths, and accordingly, to prevent an unevenly distributed current flow. The bonding strength is measured to determine whether it is satisfactory or not on the basis of currents flowing through the second welding electrodes. Also, the electronic component is fixed by the second welding electrodes after resistance welded.
Inventors:
Katsuhiro Onishi
Application Number:
JP2003017593A
Publication Date:
November 26, 2008
Filing Date:
January 27, 2003
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B23K11/00; B23K11/25; B23K31/12
Domestic Patent References:
| JP10118772A | ||||
| JP2002239748A | ||||
| JP10230370A |