Title:
配線基板およびこれを用いた半導体装置
Document Type and Number:
Japanese Patent JP4227502
Kind Code:
B2
Inventors:
Fukunaga Hideki
Application Number:
JP2003396929A
Publication Date:
February 18, 2009
Filing Date:
November 27, 2003
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12
Domestic Patent References:
| JP63165895U | ||||
| JP6334355A | ||||
| JP56040674U | ||||
| JP2003224359A |
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