Title:
電子部品の接合方法
Document Type and Number:
Japanese Patent JP4240848
Kind Code:
B2
Inventors:
Masao Nakazawa
Kenji Nakamura
Masatoshi Akakawa
Kenji Nakamura
Masatoshi Akakawa
Application Number:
JP2001181059A
Publication Date:
March 18, 2009
Filing Date:
June 15, 2001
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
C25D5/48; H01L21/60; C23F1/00; C25D7/00; C25F1/00; H05K3/26; H05K3/32; H05K3/34
Domestic Patent References:
| JP11054563A | ||||
| JP11163199A | ||||
| JP52133042A | ||||
| JP9074116A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu