Title:
ソケット及び電子部品装着装置
Document Type and Number:
Japanese Patent JP4266466
Kind Code:
B2
Abstract:
A socket (1) includes a body (1a) and a cover (3). Body (1a) has a base (2) having a horizontally movable slide (4) thereon on which a BGA package can be mounted and a plurality of contact members (6) arranged on base (2) corresponding to a pattern of solder balls of the BGA package. Each of contact members (6) has a pair of spring arms (6a, 6b) which can be opened and closed in response to movement of slide (4). In one embodiment, a cover (3) is vertically movable relative to body (1 a). The cover (3) has motion transfer portions (31) having a wedge shape which are engageable with tapered force receiving portions (43) of slide(4). As cover (3) is pushed down, engagement surfaces (31) of motion transfer portions (30) engage force receiving surfaces (43) of slide (4) and slide (4) moves so that arms (6a, 6b) of contact members (6) are opened. In another embodiment, the motion transfer parts (31) are provided on a head (11) which has an air suction holder for a BGA package.
Inventors:
Hibino Yasushi
Hideyuki Takahashi
Toyoichi Egae
Kiyokazu Ikeya
Yasuhiro Ochiai
Hideyuki Takahashi
Toyoichi Egae
Kiyokazu Ikeya
Yasuhiro Ochiai
Application Number:
JP34136099A
Publication Date:
May 20, 2009
Filing Date:
November 30, 1999
Export Citation:
Assignee:
Sensata Technologies Japan Inc.
International Classes:
H01R33/76; G01R31/26; H01R33/97; H05K7/10; H01R4/02
Domestic Patent References:
| JP11026126A | ||||
| JP60117592U | ||||
| JP11097139A | ||||
| JP10185993A | ||||
| JP2001043947A | ||||
| JP10172702A |
Foreign References:
| US5556293 |
Attorney, Agent or Firm:
Kyozo Katayose