Title:
マイクロマシンの製造方法
Document Type and Number:
Japanese Patent JP4316050
Kind Code:
B2
Abstract:
A method for making a micromachine, which includes a spherical body and a spherical shell surrounding said spherical body, comprising forming a victim layer on said spherical body to coat said spherical body, forming a function layer on said victim layer, said function layer including at least one conductive material pattern and/or insulating material layer, forming a structure layer of insulating material to coat said spherical body on which said function layer is formed, forming etching bores extending from the outer surface of said structure layer to said victim layer, and introducing gaseous etchant into said etching bores to remove said victim layer.
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Inventors:
Risa Toda
Application Number:
JP15186599A
Publication Date:
August 19, 2009
Filing Date:
May 31, 1999
Export Citation:
Assignee:
Ball Semiconductor Co., Ltd.
International Classes:
B62D57/00; B81C1/00; B25J7/00; B81B5/00; B81B7/00; G01C19/06; G01P15/00; G01P15/08; G01P15/125; G01P15/13; H01L29/06
Domestic Patent References:
| JP2000337872A | ||||
| JP2119241A | ||||
| JP7196794A | ||||
| JP5230680A | ||||
| JP6112509A | ||||
| JP8140368A | ||||
| JP8116070A |
Foreign References:
| WO2000065659A1 | ||||
| WO2000065360A1 |
Other References:
竹田宣生,ボール半導体技術,電子情報通信学会技術研究報告. ED, 電子デバイス,日本,1999年 3月 5日,p.49-55
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hidemori Matsukuma
Hironobu Isoyama
Hidemori Matsukuma