Title:
半導体回路、ブリッジ回路および半導体圧力センサ
Document Type and Number:
Japanese Patent JP4378905
Kind Code:
B2
Inventors:
Kentaro Mizuno
Atsushi Tsukada
Tokuo Fujitsuka
Atsushi Tsukada
Tokuo Fujitsuka
Application Number:
JP2001311444A
Publication Date:
December 09, 2009
Filing Date:
October 09, 2001
Export Citation:
Assignee:
Toyota Central R & D Labs.
International Classes:
G01L9/04; H01L21/761; H01L29/84
Domestic Patent References:
| JP61207047U | ||||
| JP6207871A |
Attorney, Agent or Firm:
Kaiyu International Patent Office
Hideo Kodama
Hiroaki Murase
Makoto Abe
Tomoya Suzuki
Hideo Kodama
Hiroaki Murase
Makoto Abe
Tomoya Suzuki