Title:
統合されたウェーハ温度センサ
Document Type and Number:
Japanese Patent JP4386584
Kind Code:
B2
Abstract:
Systems and methods are described for integrated (embedded) semiconductor wafer temperature measurement equipment and processes. An integrated wafer temperature measurement apparatus, comprising: a substrate; a placement resource formed in said substrate; a sensor lead located in said placement resource, said sensor lead having a first end and a second end; a sensor coupled to said first end of said sensor lead and located in said placement resource; and a sensor lead cover coupled to said substrate. The systems and methods provide advantages in that reliability is enhanced, installation and removal are facilitated, and accuracy is improved by obviating any shadowing of the substrate and reducing temperature gradients near the sensor.
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Inventors:
Lenken, Wayne, Glenn
Sun, May, H.
Mirror, pole
Roy Gordon
Bandenaville, Peter, Michael, Noel
Sun, May, H.
Mirror, pole
Roy Gordon
Bandenaville, Peter, Michael, Noel
Application Number:
JP2000559404A
Publication Date:
December 16, 2009
Filing Date:
June 07, 1999
Export Citation:
Assignee:
Sensorray Corporation
International Classes:
G01K11/12; G01K11/32
Domestic Patent References:
| JP2254331A | ||||
| JP9189613A | ||||
| JP6331457A | ||||
| JP8075559A | ||||
| JP11118616A | ||||
| JP7311095A | ||||
| JP2001074562A |
Foreign References:
| US5969639 |
Attorney, Agent or Firm:
Toshi Inoguchi