Title:
放射線放出構成部材のためのケーシング及び導体フレーム、放射線放出構成部材、放射線放出構成部材を備えたディスプレイ装置及び/又は照明装置
Document Type and Number:
Japanese Patent JP4388806
Kind Code:
B2
Abstract:
A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.
Inventors:
Karl Heinz Arund
Georg Borgner
Gunter Weiter
Georg Borgner
Gunter Weiter
Application Number:
JP2003523022A
Publication Date:
December 24, 2009
Filing Date:
August 02, 2002
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/60; H01L33/62; H01L33/48
Domestic Patent References:
| JP2000077724A | ||||
| JP4199647A | ||||
| JP2520860B2 | ||||
| JP3050355U | ||||
| JP11500584A | ||||
| JP2001118868A | ||||
| JP2000031547A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel