Title:
ウエーハの分割方法
Document Type and Number:
Japanese Patent JP4408361
Kind Code:
B2
Abstract:
A laser beam processing method comprising the step of processing-feeding a wafer having devices which are formed in a large number of areas sectioned by streets arranged in a lattice pattern on the front surface while a laser beam capable of passing through the wafer is applied to the wafer to form deteriorated layers along the streets in the inside of the wafer, wherein the laser beam is applied at a predetermined angle toward a direction intersecting at right angles to the processing-feed direction relative to a direction perpendicular to the laser beam applied surface of the wafer.
Inventors:
Yusuke Nagai
Satoshi Kobayashi
Satoshi Kobayashi
Application Number:
JP2003334951A
Publication Date:
February 03, 2010
Filing Date:
September 26, 2003
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/38; B23K26/40; H01L21/304; B23K101/40
Domestic Patent References:
| JP2003229383A | ||||
| JP11163403A | ||||
| JP3128184A | ||||
| JP2004087663A | ||||
| JP2004111428A | ||||
| JP2004111606A |
Foreign References:
| WO2002022301A1 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki