Title:
フレキシブル基板上にポリマー導波路及び駆動増幅器を集積した広帯域光変調器
Document Type and Number:
Japanese Patent JP4436766
Kind Code:
B2
Abstract:
The invention comprises a novel combination of microwave and photonic packaging to arrive at compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
Inventors:
Corn Luff, William Pea
Cladon, Glen
Dasgupta, Samhita
Filkins, Robert
Forman, Glenn
Ianotti, Joseph
Matthew Christian, Nielsen
Cladon, Glen
Dasgupta, Samhita
Filkins, Robert
Forman, Glenn
Ianotti, Joseph
Matthew Christian, Nielsen
Application Number:
JP2004565108A
Publication Date:
March 24, 2010
Filing Date:
November 25, 2003
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
G02F1/065; G02F1/225; G02F1/01
Domestic Patent References:
| JP9096746A | ||||
| JP8043652A | ||||
| JP6308519A |
Foreign References:
| WO1994006052A1 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Nobukazu Ito
Toshihisa Kurokawa
Hirokazu Ogura
Nobukazu Ito
Toshihisa Kurokawa