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Title:
感光性樹脂組成物、感光性樹脂硬化物、感光性樹脂フィルム、感光性樹脂フィルム硬化物及びこれらを用いて得られる光導波路
Document Type and Number:
Japanese Patent JP4466794
Kind Code:
B2
Abstract:
Provided are a photosensitive resin composition which is soluble in an alkaline aqueous solution and which has a good propagation loss in a visible light wavelength region, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same. Provided are, to be specific, a photosensitive resin composition comprising (A) a vinyl polymer having at least one chain-polymerizable functional group in a molecule, (B) a polymerizable compound and (C) a polymerization initiator, wherein the component (C) is at least one selected from the group consisting of 2-[2-oxo-2-phenylacetoxyethoxy]ethyl oxyphenylacetate, 2-(2-hydroxyethoxy)ethyl oxyphenylacetate and oligo{2-hyroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]}propanone, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same.

Inventors:
Koji Suzumura
Makino Tatsuya
Atsuyuki Takahashi
Application Number:
JP2009521473A
Publication Date:
May 26, 2010
Filing Date:
November 17, 2008
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/031; G03F7/027; G03F7/033
Domestic Patent References:
JP2005259192A2005-09-22
JP2006293329A2006-10-26
JP2002020411A2002-01-23
JP2005523923A2005-08-11
JP2001511137A2001-08-07
Foreign References:
WO2007074782A12007-07-05
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei
Masahiro Tsukawaki
Kenichi Hirasawa