Title:
無線ICデバイス
Document Type and Number:
Japanese Patent JP4466795
Kind Code:
B2
Abstract:
A wireless-IC-device main part (6) is disposed on a surface opposite a surface for receiving signals from a reader/writer. The wireless-IC-device main part (6) has an insulating substrate, which is provided with a loop electrode (7) and an electromagnetically coupled module (1) coupled to the loop electrode (7). A signal (magnetic field Ho) from the reader/writer causes an eddy current J to flow across a conductor principal plane of a metal article (60). The eddy current J causes a magnetic field Hi to be generated in a direction perpendicular to the conductor principal plane of the metal article (60). Then, the loop electrode 7 is coupled to the magnetic field Hi. Thus, the wireless-IC-device main part (6) functions as an RFID tag even for signals from the principal plane opposite the wireless-IC-device main part (6). It is thus possible to reduce cost of manufacturing a metal article, and provide a wireless IC device using the metal article as a radiator.
Inventors:
Tokiko Kato
Shinro Ikemoto
Shinro Ikemoto
Application Number:
JP2009522591A
Publication Date:
May 26, 2010
Filing Date:
July 02, 2008
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01Q7/00; H01Q9/40; H01Q23/00; H04B5/02
Domestic Patent References:
| JP2004140513A | 2004-05-13 | |||
| JP2001351084A | 2001-12-21 | |||
| JP2003249813A | 2003-09-05 | |||
| JP2003216919A | 2003-07-31 | |||
| JP2005124061A | 2005-05-12 | |||
| JP2003046318A | 2003-02-14 | |||
| JP2003069335A | 2003-03-07 | |||
| JP2004297681A | 2004-10-21 |
Attorney, Agent or Firm:
Kaede International Patent Office