Title:
プロジェクションシステム
Document Type and Number:
Japanese Patent JP4537311
Kind Code:
B2
Abstract:
The package (100) has a substrate (113) with an arrangement of multiple light emitting diode (LED) chips (115). The LED chips are slanted with respect to the substrate at a predetermined angle.
Inventors:
Lee Kei Hun
Application Number:
JP2005358217A
Publication Date:
September 01, 2010
Filing Date:
December 12, 2005
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
G03B21/14; G02B27/00; G03B21/00
Domestic Patent References:
| JP2004252205A | ||||
| JP2003330111A | ||||
| JP2004151657A | ||||
| JP2004145249A | ||||
| JP2003107396A | ||||
| JP2002214697A | ||||
| JP9500738A | ||||
| JP2002303820A | ||||
| JP10333599A | ||||
| JP2002543454A | ||||
| JP61212076A |
Foreign References:
| US20020140911 |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito