Title:
電子部品実装構造体の製造方法
Document Type and Number:
Japanese Patent JP4593444
Kind Code:
B2
More Like This:
Inventors:
Atsushi Oi
Application Number:
JP2005322356A
Publication Date:
December 08, 2010
Filing Date:
November 07, 2005
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L25/00; H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K1/18; H05K3/46
Domestic Patent References:
| JP2004247706A | ||||
| JP2001217337A | ||||
| JP2005294383A | ||||
| JP1140753A |
Attorney, Agent or Firm:
Keizo Okamoto