Title:
組合せクランプリング
Document Type and Number:
Japanese Patent JP4615659
Kind Code:
B2
Abstract:
The present invention provides a multi-piece clamp ring, adapted to be used in plasma assisted and other processes in electronic device fabrication and is especially suitable for use in an etching or deposition process. The clamp ring includes an upper shield portion that typically is consumed in the etching process and a lower ring portion protected by the upper shield portion which can be re-used. The upper shield portion protects the lower ring portion from the etching process. The upper shield portion is adapted to be fastened to a chamber member to retain alignment with a substrate during the etching process. The lower ring portion is allowed to move and align itself with the upper shield portion or be removably fastened with the upper shield portion.
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Inventors:
Michael babashi
David hatonic
David hatonic
Application Number:
JP2000044560A
Publication Date:
January 19, 2011
Filing Date:
February 22, 2000
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/302; H01L21/205; H01L21/3065; H01L21/683; H01L21/687
Domestic Patent References:
| JP8078509A | ||||
| JP6310435A | ||||
| JP6333877A | ||||
| JP11307513A | ||||
| JP10303184A | ||||
| JP4137748A | ||||
| JP9186226A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Okimoto Kazuaki
Yuichi Yamada
Okimoto Kazuaki