Title:
半導体装置
Document Type and Number:
Japanese Patent JP4675419
Kind Code:
B2
Abstract:
A semiconductor device includes: a first semiconductor chip having an upper face on which at least one first electrode pad is formed; a second semiconductor chip provided above the first semiconductor chip and having an upper face on which at least one second electrode pad is formed; a conductive film external to the first semiconductor chip and the second semiconductor chip; and a wire. The wire electrically connects the first electrode pad and the second electrode pad to each other via the conductive film.
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Inventors:
Kenji Yamazaki
Hiroshi Yamada
Morita Monko
Sachiko Matsumoto
Hiroshi Yamada
Morita Monko
Sachiko Matsumoto
Application Number:
JP2008524289A
Publication Date:
April 20, 2011
Filing Date:
December 21, 2007
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2000124392A | 2000-04-28 | |||
| JP2003197857A | 2003-07-11 | |||
| JP2006019531A | 2006-01-19 | |||
| JPH06224362A | 1994-08-12 |
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura