Title:
軟質材封止型パワー半導体装置
Document Type and Number:
Japanese Patent JP4692839
Kind Code:
B2
Abstract:
To provide a soft-material sealing type power semiconductor device for preventing any crack of a solder layer while suppressing the complication of a structure.
In a soft-material sealing type power semiconductor device in one side lead structure, a lead header 2 of a lead 1 soldered to a power semiconductor element chip 3 by a solder layer 6 is made thin according as it goes toward a peripheral section 21. Thus, it is possible to satisfactorily suppress the generation of the crack of the solder layer 6, even when a tensile force acts on the lead 1 of the soft-material sealing type power semiconductor device.
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
Shigekazu Kataoka
Application Number:
JP2006207926A
Publication Date:
June 01, 2011
Filing Date:
July 31, 2006
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/50; H01L21/56; H01L23/48
Domestic Patent References:
| JP2004214517A | ||||
| JP2004289028A | ||||
| JP4229639A | ||||
| JP11330332A |
Foreign References:
| WO2005048344A1 |
Attorney, Agent or Firm:
Hiroshi Okawa