Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
加工機械
Document Type and Number:
Japanese Patent JP4783000
Kind Code:
B2
Abstract:

To provide a machining apparatus which can implement most efficient machining depending on a material of a workpiece.

The machining apparatus for machining a workpiece is comprised of at least one of a heating means for heating the workpiece and a cooling means for cooling the same. For example, a heating and cooling means 8 for heating and cooling the workpiece is formed of a heat generating and absorbing circuit 81 including a Peltier device 815 built in a workpiece holding means 3. To operate the machining apparatus, direct current is applied to the Peltier device 815 to generate a heat generating phenomenon and a heat absorbing phenomenon, and therefore the workpiece is heated and cooled. Further the machining apparatus is comprised of a heat radiating means 9 for easing redundant heat generating action and heat absorbing action generated from the heat generating and absorbing circuit 81.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Masato Shiozaki
Hama Minoru Mura
Haruhito Sugiyama
Application Number:
JP2004282409A
Publication Date:
September 28, 2011
Filing Date:
September 28, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toshiba Machine Co., Ltd.
International Classes:
B23Q11/10; B23Q11/00; H01L35/30
Domestic Patent References:
JP7017193A
JP59192401A
JP63288602A
JP60099502A
JP2002355727A
JP2004066437A
Attorney, Agent or Firm:
Intellectual Property Office
Kinoshita Minoru
Kanji Nakayama
Tsuyoshi Ishizaki