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Patent Searching and Data


Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4792996
Kind Code:
B2
Inventors:
Yuichi Hayasaki
Application Number:
JP2006018064A
Publication Date:
October 12, 2011
Filing Date:
January 26, 2006
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H01L23/52; H01L21/3205
Domestic Patent References:
JP9045766A
JP4023450A
JP1309351A
JP2003332270A
JP6275713A
Attorney, Agent or Firm:
Mutsumi Yanase
Masaaki Utsunomiya
Atsushi Watanabe
Harada victory