Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP4971930
Kind Code:
B2
Abstract:
A plasma processing apparatus includes a barrier wall member disposed between a plasma generation chamber and a processing chamber to separate the plasma generation chamber from the processing chamber. The barrier wall member assumes a fin structure achieved by disposing in a radial pattern numerous plate-like fin members extending from a central area thereof toward a peripheral edge. An upper end portion of each fin member overlaps a lower end portion of an adjacent fin member. The fin members are disposed with gaps formed between them and are made to range upward with a tilt along the circumferential direction.
More Like This:
| WO/2012/073449 | PLASMA PROCESSING DEVICE |
| JPH11274116 | POLISHING METHOD, GAS POLISHING NOZZLE, AND POLISHING APPARATUS THEREFOR |
| JPH0756868 | [Title of Invention] Etching Method |
Inventors:
Daisuke Hayashi
Application Number:
JP2007256561A
Publication Date:
July 11, 2012
Filing Date:
September 28, 2007
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065
Attorney, Agent or Firm:
Hiroaki Oyama