Title:
半導体装置及びワイヤボンディング方法
Document Type and Number:
Japanese Patent JP5002329
Kind Code:
B2
Abstract:
The invention relates to a semiconductor device and a wire bonding method. In the semiconductor device, a wire is stacked on a pad (3) as a second bonding point to form a bump (21) having a sloped wedge (22) and a first bent wire convex portion (21), and a wire (12) is looped from a lead as a first bonding point to the bump (21) and is pressed to the sloped wedge (22) of the bump (21) with a faceportion (33) of a tip end of a capillary to bond the wire to the bump (21). At the same time, the wire (12) is pressed to the first bent wire convex portion (25) using an inner chamfer (31) of a bonding wire hole in the capillary to form a wire bent portion (20) having a bow-shaped cross section. The wire (12) is pulled up and cut at the wire bent portion (20). In the semiconductor device, improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality are provided.
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Inventors:
Ritsunari Mitsui
Toshihiko Tomiyama
Hiroaki Yoshino
Toshihiko Tomiyama
Hiroaki Yoshino
Application Number:
JP2007136106A
Publication Date:
August 15, 2012
Filing Date:
May 23, 2007
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP2005175175A | ||||
| JP2004247672A | ||||
| JP2000036512A | ||||
| JP2969953B2 |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida