Title:
DEVICE AND METHOD FOR THERMOCOMPRESSION-BONDING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3412499
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method for thermocompression-bonding electronic component so as to deal with the load of pressing over wide ranged through one device.
SOLUTION: Concerning the thermocompression-bonding method for electronic component with which an electronic component 5 is pressed by a pressing head 7 and the electronic component is thermocompression-bonded while detecting and controlling this pressing load, two of first pressing head 7A for heavy pressing load and second pressing head 7B for light pressing load are selectively used and when using the first pressing head 7A, a load cell 26 arranged between a first lift block 10 and a second lift block 20 is used but when using the second pressing head 7B, a load cell for light load built in the second pressing head 7B is used. Thus, the pressing load can be accurately detected while using the load detecting means corresponding to the object electronic component and electronic components over wide ranges can be thermocompression-bonded by one thermocompression bonding device.
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Inventors:
Kazuo Arimon
Kenichi Ohtake
Kenichi Ohtake
Application Number:
JP6659698A
Publication Date:
June 03, 2003
Filing Date:
March 17, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60; H01L21/603
Domestic Patent References:
| JP6216198A | ||||
| JP3215953A | ||||
| JP897246A | ||||
| JP1241889A | ||||
| JP3246953A | ||||
| JP1064931A | ||||
| JP10199940A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)