Title:
金属配線評価用パターン、半導体装置及び評価方法
Document Type and Number:
Japanese Patent JP5057176
Kind Code:
B2
Inventors:
Umeno Akinori
Kazuhiko Hirakawa
Kazuhiko Hirakawa
Application Number:
JP2009077629A
Publication Date:
October 24, 2012
Filing Date:
March 26, 2009
Export Citation:
Assignee:
Japan Science and Technology Agency
International Classes:
H01L21/66; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP3195035A | ||||
| JP4154142A | ||||
| JP5190638A | ||||
| JP6209034A | ||||
| JP11067861A | ||||
| JP2001007175A |
Attorney, Agent or Firm:
Kazuyuki Hirayama
Tetsuya Shinoda
Kota Ogawa
Tetsuya Shinoda
Kota Ogawa