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Title:
金属配線評価用パターン、半導体装置及び評価方法
Document Type and Number:
Japanese Patent JP5057176
Kind Code:
B2
Inventors:
梅野 顕憲
平川 一彦
Application Number:
JP2009077629A
Publication Date:
October 24, 2012
Filing Date:
March 26, 2009
Export Citation:
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Assignee:
独立行政法人科学技術振興機構
International Classes:
H01L21/66; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
JP3195035A
JP4154142A
JP5190638A
JP6209034A
JP11067861A
JP2001007175A
Attorney, Agent or Firm:
平山 一幸
篠田 哲也
小川 耕太



 
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