To provide electronic equipment having improved cooling efficiency for electronic components housed in a casing without causing the increase of the power consumption or noise of a fan or the increase of the size of a cooling device.
Electronic equipment is provided with: a casing 10 equipped with an exhaust port 23; a radiator 32 arranged adjacently to the exhaust port 23 in the casing 10; a heat transmission means 33 for connecting the first heating element 25a arranged in the casing 10 and the radiator 32; a fan 41 for cooling the radiator 32 by blowing air to the radiator 32; and an air duct 35 connected to a portion of a blower port 48 of the fan 41 for guiding a portion of air sent out from the fan 41 to a second heating element 25b arranged in the casing 10, and configured to cool a second heating element 25b by blowing a portion of air sent out from the fan 41 through the air duct 35 to the second heating element 25b.
COPYRIGHT: (C)2010,JPO&INPIT
Yoshiharu Uchiyama
JP2001257494A | ||||
JP2003046046A | ||||
JP2004199538A |
US20050103477 |
Hiroaki Sakai