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Patent Searching and Data


Title:
電子機器
Document Type and Number:
Japanese Patent JP5061068
Kind Code:
B2
Abstract:

To provide electronic equipment having improved cooling efficiency for electronic components housed in a casing without causing the increase of the power consumption or noise of a fan or the increase of the size of a cooling device.

Electronic equipment is provided with: a casing 10 equipped with an exhaust port 23; a radiator 32 arranged adjacently to the exhaust port 23 in the casing 10; a heat transmission means 33 for connecting the first heating element 25a arranged in the casing 10 and the radiator 32; a fan 41 for cooling the radiator 32 by blowing air to the radiator 32; and an air duct 35 connected to a portion of a blower port 48 of the fan 41 for guiding a portion of air sent out from the fan 41 to a second heating element 25b arranged in the casing 10, and configured to cool a second heating element 25b by blowing a portion of air sent out from the fan 41 through the air duct 35 to the second heating element 25b.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Takuro Uemura
Yoshiharu Uchiyama
Application Number:
JP2008224965A
Publication Date:
October 31, 2012
Filing Date:
September 02, 2008
Export Citation:
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Assignee:
Lenovo Singapore Private Limited
International Classes:
G06F1/20; H05K7/20
Domestic Patent References:
JP2001257494A
JP2003046046A
JP2004199538A
Foreign References:
US20050103477
Attorney, Agent or Firm:
Masashi Hakamada
Hiroaki Sakai