To provide a solder cutting method for reducing solder defects of a soldering device that moves a pallet device holding a printed board to achieve soldering to the printed board, and the pallet device used for the method.

In the solder cutting method, the printed board 7 as well as the pallet device 1 are dipped in molten solder 82 and then while the pallet device is left at a dipping position, only the printed board is tiled and separated from the liquid surface of the molten solder. The pallet device used for the method includes a tilting mechanism 4 which elevates only the printed board held by the pallet device while tilting the board to the liquid surface. The tilting mechanism comprises an engagement frame 5 to be engaged with a one end-side reverse surface of the printed board held by the pallet device, and a vertical movement means 6 for moving up and down the engagement frame. The vertical movement means is configured to lift a hook portion of the engagement frame by holding a claw portion and to tilt and separate the printed board from a substrate support portion 3.

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