Title:
キャリア、キャリアを被覆する方法並びに半導体ウェハの両面を同時に材料除去する加工方法
Document Type and Number:
Japanese Patent JP5207909
Kind Code:
B2
Abstract:
Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.
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Inventors:
Georg Peaches
Michael Kelstan
Heiko Ausdem Spring
Michael Kelstan
Heiko Ausdem Spring
Application Number:
JP2008260480A
Publication Date:
June 12, 2013
Filing Date:
October 07, 2008
Export Citation:
Assignee:
Siltronic AG
Peter Wolters GmbH
Peter Wolters GmbH
International Classes:
H01L21/304; B24B37/28; B24B41/06
Domestic Patent References:
| JP2000127030A | ||||
| JP2010510083A | ||||
| JP11033895A | ||||
| JP60197366A | ||||
| JP2003305637A | ||||
| JP2000288922A | ||||
| JP2007098543A | ||||
| JP2001287155A | ||||
| JP2001358095A | ||||
| JP2004148497A | ||||
| JP2007245571A |
Attorney, Agent or Firm:
Fukami patent office