To provide an optical module that is excellent in acquisition of DC light characteristics of the optical module in a design stage, excellent in manufacturability such as reflow resistance, has high reliability and can be inexpensively manufactured.
An upper structure 5 having an optical transmission body such as an optical fiber 7 constituting an optical transmission path and a holding member 6 holding the optical transmission body is fixed to an upper face of an electronic component mounting substrate 30 on a wiring board 70 mounting a plurality of electronic components including an optical element 40 and a driver integrated circuit device 41, by pressing in a perpendicular direction by use of an attachment such as a fastening member 50, so as to optically connect the optical transmission path of the upper structure 5 to the optical element 40 on the electronic component mounting substrate 30. The optical element 40 and the driver integrated circuit device 41 are electrically connected to the electronic component mounting substrate 30 by flip-chip connection.
COPYRIGHT: (C)2009,JPO&INPIT
Hiroshi Nakagawa
Katsuya Kikuchi
Takashi Mikawa
Yoshikuni Okada
Atsushi Suzuki
Teiichi Suzuki
Tamura Mitsuaki
Yoichi Hashimoto
Hiroshi Masuda
Shuji Suzuki
Wakazono Yoshitsugu
Takakawa Ishikawa
Nippon Special Ceramics Co., Ltd.
Sumitomo Electric Industries, Ltd.
NEC
Hitachi Chemical Co., Ltd.
IBIDEN CO.,LTD.
Fujikura Ltd.
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