To enable efficient production of high quality spherical semiconductor particles having a small dispersion of mass and dimension in a method of producing semiconductor particles by melting a predetermined amount of semiconductor powder to form spherical melt particles and cooling these to solidify.
A small lump containing a predetermined amount of semiconductor powder is preliminary heated in an inert atmosphere in a preliminary heating part 43 of a heat treating furnace 41 to a temperature in the proximity of a melting point of the powder and the temperature not reaching the melting one. Then, the small lump is heated in an atmosphere of the inert gas appropriately mixed with oxygen in a melting part 44 at a temperature not lower than a melting point of the powder to form the semiconductor melt particles. The melt particles are cooled in a cooling part 45 to solidify, and thereafter taken out to the outside to recover. As for the small lump, it is preferable to use an article molded to a predetermined form by adding an organic binder to the semiconductor powder.
COPYRIGHT: (C)2010,JPO&INPIT
Toshiyuki Nakamura
Yoshihiro Akashi
Murozo Mikio
| JP2008239438A | ||||
| JP2008143754A | ||||
| JP2001501779A |
| WO2008057483A1 | ||||
| US2637855 |
Shinichi Kawasaki