Title:
回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板
Document Type and Number:
Japanese Patent JP5304993
Kind Code:
B2
Inventors:
Atsushi Baba
Yuki Kuda
Yuki Kuda
Application Number:
JP2008200398A
Publication Date:
October 02, 2013
Filing Date:
August 04, 2008
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
B24B37/00; B82Y99/00; C09K3/14; H05K3/26
Domestic Patent References:
| JP2008124222A | ||||
| JP2003257910A | ||||
| JP2006310596A | ||||
| JP2005302973A | ||||
| JP2004204155A | ||||
| JP200331529A | ||||
| JP2003342554A | ||||
| JP2004331753A |
Attorney, Agent or Firm:
Mitsue Obuchi
Yukio Fuse
Yukio Fuse
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