携帯端末部品 - Wintech Polymer Co., Ltd.

Title:

携帯端末部品

Document Type and Number:

Japanese Patent JP5329804

Kind Code:

B2

Abstract:

Provided is a mobile terminal part formed from a polybutylene-telephtalate resin composition having excellent properties such as a mechanical strength and a shock resistance and causing little shrinkage or warp deformation. More specifically, the polybutylene-telephtalate resin composition is prepared by mixing [A] 100 % by weight of denaturated polyethylene-telephtalate resin and [B] 40 to 140 % by weight of glass fiber having a flat cross sectional shape.

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Inventors:

Wakazuka Kiyoshi
Hiroyuki Amano

Application Number:

JP2007334706A

Publication Date:

October 30, 2013

Filing Date:

December 26, 2007

Export Citation:

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Assignee:

Wintech Polymer Co., Ltd.

International Classes:

C08L67/02; C08K3/40; C08K7/14; H05K5/02

Domestic Patent References:

JP3095257A
JP2001339235A
JP9286036A
JP9216245A
JP2006176691A
JP2007091865A

Foreign References:

WO2005083991A1

Attorney, Agent or Firm:

Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa

Previous Patent: JPS5329803

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